Consortium

Institute of Communication & Computer Systems/National Technical University of Athens (ICCS/NTUA)
ICCS/NTUA is the coordinating organization of POLYSYS and is participating in the project with its Photonic Communications Research Laboratory (PCRL). ICCS/NTUA will take actively part in the definition of the system-level specifications and the system-level modelling of the final devices. ICCS/NTUA will also participate in the testing of the preliminary modules contributing to the iterative development cycles and will lead the effort for the system-level testing of the final POLYSYS devices.     

Contact: Hercules Avramopoulos, Christos Kouloumentas, Panos Groumas, Vasilis Katopodis 

 

Heinrich Hertz Institut (HHI)

HHI is participating in POLYSYS project with its polymer group and detector group.  HHI will design complex passive structures (i.e. multi-mode interference couplers-MMI couplers and Bragg-gratings) on the elecro-optic polymer platform and will develop the required techniques for the hybrid integration of active InP elements with the polymer boards. HHI will also develop arrays of ultra-high speed InP photodiodes and photoreceivers and will take actively part in the system integration and packaging of the receiver modules.     

Contact: Dr. Ziyang Zhang, Dr. Norbert Keil, Dr. Heinz-Gunter Bach, Dr. Norbert Grote

 

Alcatel-Thales III-V lab (ATL)

ATL will lead the effort for the development of very high speed integrated circuits (VHSICs) for the POLYSYS devices. These electronics include arrayed 2:1 MUX, modulator drivers, 1:2 DEMUX and clock and data recovery circuits, capable of operating directly at 100 Gb/s. For this development, ATL will exploit its 0.7 μm InP Double Heterojunction Bipolar Transistor (InP-DHBT) technology. ATL will also coordinate the task for the definition of the low-level specifications of the different components in order to ensure the compatibility of their geometries and functionalities. 

Contact: Mr. Jean Godin, Dr. Agnieszka KoŇĄczykowska

 

GigOptix-Helix AG (GO)

GO will fabricate the polymer boards of POLYSYS devices using its eletro-optic polymer platform. The boards will contain monolithically integrated arrays of ultra-high speed modulators and complex passive structures such as MMI couplers and Bragg-gratings. GO will also lead the tasks for the dissemination and exploitation of the POLYSYS technology and the efforts for contribution to relevant  standardization activities.  

Contact: Dr. Martin Bossard, Dr. Raluca Dinu, Dr. Giulio Cangini

 

Linkra-Teleoptix (TEO)

TEO will lead the effort within POLYSYS for the system integration of the individual optical, optoelectronic and electronic components and the packaging of the final devices. TEO will use advanced tools to design high-speed electrical connections, temperature controlling subsystems and fiber pigtails, and deliver packaged modules with optimized electromagnetic, thermal and mechanical behavior.

Contact: Dr. Antonello Vannucci