Devices and applications

Ultra-high speed photonic and electronic components developed under POLYSYS, will be ultimately integrated to form three discrete devices with diverse apllication areas:

1) The migration to the next standard of Ethernet protocol (100 GbE) requires novel types of optical transceivers. POLYSYS relies on the potential of polymer modulators and InP receivers and electronics for introducing devices that can operate directly at 100 Gb/s without the complexity of advanced modulation formats and polarization diversity. The transmitter and reciver modules will be co-packaged to demonstrate the full functionality of a transceiver that can be used in next-generation 100GbE telecom systems.


2) The incorporation of thousands of servers in modern data centers has created the necessity to transfer massive amounts of data between racks efficiently and at low cost. Connectivity is thus a key factor and it is today well understood that electrical cables cannot accomodate this bandwidth explosion. The "infiltration" of photonics in data centers is already evident, as active optical cables are used to carry hundreds of gigabits/s through hundreds of meters. POLYSYS is aiming at create arrays of 100 Gb/s polymer-based transmitters and InP receivers in order to demonstrate an unprecedented throughput of 400 Gb/s in data communications. 


3) Moving to shorter distances, optical interconnects will ultimately penetrate into board-level and chip-level connectivity. Ideally these optical interconnects have to rely on material systems that are compatible with the current evolution towards functional, cost-effective polymer backplanes. POLYSYS is aiming at demonstrating an integrated optical interconnect at 100 Gb/s, exploring the way for ultra-fast chip-to-chip interconnects.